Employment Opportunities

Job Location

• Raleigh, NC

About the Department

North Carolina State University is leading the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS). This initiative, part of the larger $238 million investment through the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, aims to revolutionize the field of wide bandgap semiconductors.

Hub leadership, Distinguished Professors John Muth and Fred Kish, are dedicated to the “lab to fab” journey—translating laboratory advancements into fabrication capabilities for wide bandgap semiconductors. The hub brings together a dynamic partnership with N.C. State University and industry leaders, including Wolfspeed, Coherent Corp., General Electric, Bluglass, Adroit Materials, and Kyma Technologies, Inc. This collaborative effort will propel the development of semiconductors crucial for national defense, electric vehicles, power grid technologies, 5G/6G, quantum technologies, and artificial intelligence applications.

Essential Job Duties

The CLAWS Hub is looking to hire two Senior Fabrication Engineers. The key responsibilities of the Senior Fabrication Engineer will include:

• Work in a cleanroom environment.
• Develop standard processes using semiconductor fabrication equipment, such as lithography tools, dry etchers, and metal deposition tools.
• Ensure that the standard processes meet the required specifications.
• Generate Standard Operating Procedure documents for semiconductor fabrication tools.
• Train users on fabrication tools so they can run the equipment on their own in a safe and responsible manner.
• Interface with remote users and assist in process development.
• Install new semiconductor fabrication tools.
• Carry out preventative maintenance on tools to ensure they operate without interruptions
• Troubleshoot fabrication tools to quickly identify problems
• Work with CLAWS hardware engineer/technicians or external vendors to carry out minor repairs on tools
• Arrange service visits for major repairs
• Participate in safety audits to ensure fab is being operated in safe manner

Other Responsibilities

• Perform all necessary day to day tasks required to operate a multi-user facility such as ordering and maintaining consumables inventory, contributing to housecleaning/lab organization, maintaining documentation, etc.

Minimum Education and Experience

• M.S. or Ph.D. in Science or Engineering discipline
• Three or more years of experience working with semiconductor fabrication in a university, government, or industry cleanroom

Other Required Qualifications

• Excellent verbal and written communication skills and solid interpersonal skills
• Ability to multitask and meet deadlines
• Must be able to work independently as well as make positive team contributions
• Ability to work and communicate effectively with all levels of personnel
• Must be able to operate tools in the facility and train users to use the equipment independently
• Must be comfortable working with semiconductor fabrication equipment, such as lithography tools, dry etchers, and metal deposition tools
• Must be comfortable working with students
• Must be comfortable working safely with chemicals
• Must be comfortable working safely with compressed gas cylinders
• Eligibility to obtain clearance upon request of the US government.

Preferred Qualifications

• Ph.D. in Science and Engineering discipline
• Five or more years of experience working with semiconductor fabrication in a university, government, or industry cleanroom

Job Location

• Raleigh, NC

About the Department

North Carolina State University is leading the charge as the recipient of a $39.4 million award from the Department of Defense to establish the regional Microelectronics Commons regional innovation hub, Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS). This initiative, part of the larger $238 million investment through the Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act, aims to revolutionize the field of wide bandgap semiconductors.

Hub leadership, Distinguished Professors John Muth and Fred Kish, are dedicated to the “lab to fab” journey—translating laboratory advancements into fabrication capabilities for wide bandgap semiconductors. The hub brings together a dynamic partnership with N.C. State University and industry leaders, including Wolfspeed, Coherent Corp., General Electric, Bluglass, Adroit Materials, and Kyma Technologies, Inc. This collaborative effort will propel the development of semiconductors crucial for national defense, electric vehicles, power grid technologies, 5G/6G, quantum technologies, and artificial intelligence applications.

Essential Job Duties

The CLAWS Hub is looking to hire two entry level Fabrication Engineers. The key responsibilities of the Fabrication Engineer will include:

• Work in a cleanroom environment
• Develop standard processes using semiconductor fabrication equipment, such as lithography tools, dry etchers, and thin film deposition tools.
• Ensure that standard processes meet the required specifications.
• Generate Standard Operating Procedure documents for semiconductor fabrication tools.
• Train users on fabrication tools so they can run the equipment on their own in a safe and responsible manner.
• Interface with remote users and assist in process development.
• Install new semiconductor fabrication tools.
• Carry out preventative maintenance on tools to ensure they operate without interruption
• Troubleshoot fabrication tools to quickly identify problems
• Work with CLAWS hardware engineer/technicians or external vendors to carry out minor repairs on tools
• Arrange service visits for major repairs
• Participate in safety audits to ensure fab is being operated in safe manner

Other Responsibilities

• Perform all necessary day to day tasks required to operate a multi-user facility such as ordering and maintaining consumables inventory, contributing to housecleaning/lab organization, maintaining documentation, etc.

Minimum Education and Experience

• Associate degree in Science or Engineering discipline, or equivalent military electronics training
• Two years of experience in working in a lab, even in a classroom setting

Other Required Qualifications

• Excellent verbal and written communication skills and solid interpersonal skills
• Ability to multitask and meet deadlines
• Must be able to work independently as well as make positive team contributions
• Ability to work and communicate effectively with all levels of personnel
• Must be able to operate tools in the facility and train users to use the equipment independently
• Must be comfortable working with semiconductor fabrication equipment, such as lithography tools, dry etchers, and metal deposition tools
• Must be comfortable working with students
• Must be comfortable working safely with chemicals
• Must be comfortable working safely with compressed gas cylinders
• Eligibility to obtain clearance upon request of the US government.

Preferred Qualifications

• B.S. or M.S. in Science and Engineering discipline
• Three or more years of experience working with semiconductor fabrication in a university, government, or industry cleanroom

Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic systems.

Job Description: 2nd Shift Packaging and Assembly Engineer

Location: Research Triangle Park, NC

Summary:
The Packaging and Assembly Engineer will develop and manage all related assembly processes, such as die attaching, wire bonding, stack die packaging, and flip-chip assembly processing. This engineer will support documentation, implementation, and improving robust mechanical assembly methodology in the areas of IR scene projector arrays, detector modules, RF or Digital semiconductor electrical component and IC chips assembly and packaging in a broad range of configurations.
The Packaging and Assembly Engineer will routinely interact with Program Managers, and Engineering, Quality, as well as External Customers and Suppliers as needed, to provide outstanding assembly and packaging support to ensure revenue and customer satisfaction goals are met!
The applicant should also be willing to work second shift hours (3PM – 12AM).

Essential Duties & Responsibilities:

• Develop and manage assembly processes – such as die attaching, wire bonding, underfill, flip-chip assembly process,
• Assist with development and design of advanced packaging and electromechanical fixturing for customer requirements or internal demands
• Conceive methods and processes to meet customer’s prototype packaging and assembly requirements
• Develop bills of materials and operation routers for assembly projects including time studies and workflow analysis
• Support operation of semiconductor processing equipment
• Drive cost reduction and yield improvement projects

Job Qualifications:

• Semiconductor wafer processing experience in a cleanroom environment is a plus.
• Associate, or BS in physical science/technology/engineering, or 3+ years of cleanroom or semiconductor processing experience
• Due to export control rules, must be a US citizen or permanent resident.

Contact:

• Rex Anderson, Director of Operations: rex.anderson@micross.com
• John Lannon, General Manager: john.lannon@micross.com

Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D  heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic  systems. 

Job Description: 3D Heterogeneous Integration Development Engineer (Semiconductors)

Location: Research Triangle Park, NC 

Summary:  

This position will support the Micross 3D Heterogeneous Integration program areas, including development of  semiconductor advanced packaging processes and technologies such as TSV processing, wafer thinning & handle  wafer processes, thermal compression bonding, etc. Wafer-level packaging & interconnects: bumps, Cu pillars, &  redistribution 

Essential Duties & Responsibilities: 

• Support Program Managers and technology development projects in the form of day-to-day project  management to ensure customer deliverables and internal development project deliverables are successful  and remain on schedule.  
• Semiconductor process development, building process flows & lot travelers, lot management &  engineering support, as well as providing budgetary input on bids/proposals, and technical support for  Program Managers on large proposals.  
• Duties may include development of photolithographic processing, wet processing, dry etching, thin film  deposition, electroplating, and die assembly processes. The position may also require performing mask  design & layout, electrical testing, and other forms of material & process characterization.  

Job Qualifications: 

• Due to export control rules, must be a US person. 
• M.S. or Ph.D. degree in a physical science or engineering, or BS and +5 years’ experience in Advanced  Packaging and Interconnects or Semiconductor Processing 
• Experience with integrated wafer fabrication process flows strong background in back-end-of-the-line  (BEOL) semiconductor processing (e.g. MEMS or other post-CMOS processing). Experience in advanced  packaging and/or 3D integration processes is desired. 

Contact: 

• Rex Anderson, Director of Operations: rex.anderson@micross.com 
• John Lannon, General Manager: john.lannon@micross.com 

Salary and benefits commensurate with qualifications and experience.

Micross is an equal opportunity employer. 

Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D heterogeneous  integration (3DHI) solutions that enable higher-performance, next generation electronic systems. 

Job Description: 2^nd Shift Process Engineer 

Location: Research Triangle Park, NC 

Summary: 

The Process Engineer will primarily focus on semiconductor processing required to support wafer level packaging  (WLP) and 3D heterogeneous integration (3DHI) processes. This may include sputter deposition, e-beam  evaporation, photoresist coats, photoresist develops, dry etches, resist strips, immersion wet etches, microscope  inspections, and thin film metrology. The successful candidate will need to develop an understanding of relevant  process integration dependencies. Understanding the importance of processing results and the need for supporting  lot/project schedules is critical. 

The Packaging and Assembly Engineer will routinely interact with Program Managers, Engineering, Quality, as  well as external customers and suppliers as needed, to provide outstanding semiconductor fabrication support to  ensure revenue and customer satisfaction goals are met! 

The applicant should also be willing to work second shift hours (3PM – 12AM). 

Essential Duties & Responsibilities: 

• Hands-on engineering resource for wafer processing of both test and device wafers. • Communicating results and concerns in a collaborative, data-driven environment.  
• Participate and conduct process improvement experiments, as needed; accurately recording and reporting  data 
• Employ standard troubleshooting protocols 
• Support operation of semiconductor processing equipment 
• Drive cost reduction and yield improvement projects 

Job Qualifications: 

• Semiconductor wafer processing experience in a cleanroom environment is a plus. 
• Associate, or BS in physical science/technology/engineering, or 3+ years of cleanroom or semiconductor  processing experience 
• Due to export control rules, must be a US citizen or permanent resident. 

Contact: 

• Rex Anderson, Director of Operations: rex.anderson@micross.com 
• John Lannon, General Manager: john.lannon@micross.com

Micross Advanced Interconnect Technology (AIT) is looking for engineers interested in a wafer  processing internship at our Research Triangle Park, NC facility. As part of the internship, the interns will  assist our operations team in standard wafer processes such as sputter deposition, dry etch (RIE),  photolithography, wet etch, resist coats, polymer coats, resist strips, microscope inspections, and thin film  metrology. The internships run during the Spring semester with an option to extend through the summer.  Micross AIT pays interns an hourly rate with compensation dependent upon the years of school completed  toward your degree. 

Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D  heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic  systems. 

If you are interested in an internship at Micross AIT, please contact:

• Rex Anderson, Director of Operations: rex.anderson@micross.com
• John Lannon, General Manager: john.lannon@micross.com

Job Title: Instrumentation Engineer 

Location: Centennial Campus 

Position Type: Paid Internship (8 hours per week) 

You will work for Adroit Materials, a small company specializing in the growth and  fabrication of III-Nitride materials and the development of devices based on these  materials. We are seeking a paid intern to assist in integrating a recently developed  UVC detector with electronic components to create a fully integrated system. 

Key Responsibilities: 

System integration and prototyping: Design, construct, and test a system to integrate the UVC detector with controlling electronic circuits, ensuring seamless communication  and functionality. 

Testing: Test prototypes to validate performance and identify areas for improvement. 

Control development: Develop firmware for the controller to process signals from the  detector and execute control functions. 

Documentation: Document designs, processes, and results to support knowledge  transfer and future iterations of the system. 

Training for responsibilities will be provided. 

Qualifications: 

Currently pursuing a degree in Electrical Engineering, Mechanical Engineering, or a  related field. Strong understanding of electronic components and integrated circuits. Experience with coding in Python or a similar programming language is beneficial. 

A commitment for 12 months is desired. U.S. working permit is required. Ability to follow SOPs and maintain a safe working environment is required.

What We Offer: 

Valuable hands-on experience in a professional setting. Exposure to cutting-edge  technology and materials science projects. Collaborative and supportive work  environment. Flexible work hours (8 hours per week). 

Note: This job offering is not related to NC State. 

How to Apply: Please send your resume and a short paragraph highlighting your  technical experience to info@adroitmaterials.com.

Job Title: Process Engineer 

Location: Centennial Campus 

Position Type: Full-time 

You will work for Adroit Materials, a small company specializing in the growth and  fabrication of III-Nitride materials and the development of devices based on these  materials. We are seeking skilled and motivated engineers to join our dynamic team, focusing on development of III-Nitride processes and advanced electronic and  optoelectronic devices based on GaN, AlN, and AlGaN. 

Key Responsibilities: 

• Design and optimization of processes for the fabrication of III-Nitride-based devices, including photodetectors, LEDs, and transistors. 
• Characterization of materials and device structures. 
• Process development to enhance device performance, yield, and reliability. 
• Operating and maintaining processing equipment, including deposition tools,  etchers, and lithography systems. 
• Providing technical expertise and support to troubleshoot process issues and  resolve production challenges. 
• Document designs, processes, and results to support knowledge transfer and  future iterations of the system. 

Training for responsibilities will be provided. 

Qualifications: 

• A strong background in materials science and semiconductor physics. Familiarity  with III-Nitride materials and devices thereof is a plus. 
• Hands-on experience in semiconductor processing, including photolithography,  etching, deposition, and relevant characterization. 
• Hands-on experience in vacuum technology, epitaxy, and semiconductor  fabrication methods is desirable. 
• Excellent problem-solving skills and the ability to work effectively in a  collaborative, interdisciplinary environment

adroitmaterials.com 

U.S. working permit is required. 

Ability to follow SOPs and maintain a safe working environment is required.

Education: 

• Ms. or Ph.D. degree in MSE, EE, Physics, or a related discipline; exceptional  B.S. candidates will also be considered 

What We Offer: 

Valuable hands-on experience in a professional setting. Exposure to cutting-edge  technology and materials science projects. Collaborative and supportive work  environment. Flexible work hours (8 hours per day). 

Note: This job offering is not related to NC State. 

How to Apply: Please send your resume and a short paragraph highlighting your  technical experience to info@adroitmaterials.com.

Company Overview: 

Protronics is a leading player in the field of Printed Circuit Board (PCB) assembly and manufacturing, specializing in delivering high-quality electronic solutions to diverse industries. Our commitment to innovation, precision, and efficiency sets us apart, we are seeking a skilled IPC instructor to join our dynamic team and contribute to the production of high-quality electronic products. 

Key Responsibilities: 

Electronics Manufacturing Training: 

• Delivering effective electronics manufacturing training including IPC Certification to adult students from the electronics manufacturing industry. 
• Train and certify operators, inspectors, engineers and other trainers to one of six IPC Certification Programs: IPC-A-600, IPC-A-610, IPC/WHMA-A-620, IPC J-STD-001, IPC 7711/7721 and IPC-6012. 
• Conduct training at one of our public training centers or will travel directly to the customer’s facility. 

Collaboration: 

• Work closely with engineers and other team members to identify training and workforce development opportunities. 
• Provide input on process improvements to enhance efficiency and product quality. 

Documentation: 

• Maintain accurate records of IPC training activities, including certifications and work performed. 
• Report any deviations from processes or quality issues to supervisors. 

Safety Compliance: 

• Adhere to safety protocols and guidelines to ensure a secure working environment.
• Participate in safety training programs and promote a culture of safety within the team.

Qualifications: 

Experience: 

• Candidates must have a minimum of 5 years of electronics manufacturing experience. This experience can include printed circuit board fabrication, circuit board assembly, and/or wire and cable harness assembly. Soldering experience of through-hole and/or surface mount components is highly preferred. 
• Technical certification in electronics, PCB assembly, or a related field is a plus.
• Familiarity with IPC standards and industry best practices. 

Skills: 

• Candidate must have IPC training experience, either currently or in the past. A current and valid Certified IPC Trainer certificate holder is highly preferred. 
• Applicants must have the ability to work with little to no supervision and make appropriate and professional decisions. 
• Proficient in surface mount and through-hole soldering. 
• Strong attention to detail and precision in assembly work. 
• Ability to read and interpret assembly drawings and specifications. 

Team Player: 

• Effective communication and collaboration skills within a team environment.
• The candidate’s home location is not critical, however, proximity to the North Carolina or Virginia area is a plus. Relocation is not required. Several IPC Certification courses can be taught remotely and require no travel. 

Benefits: 

• Competitive salary commensurate with experience. 
• Comprehensive health and retirement benefits. 
• Opportunities for professional development and growth. 
• A collaborative and innovative work environment. 

How to Apply: 

Interested candidates are invited to submit their resumes and cover letter to quadri@protroincs-inc.com 

Protronics is an equal-opportunity employer. We encourage candidates from all backgrounds to apply. 

Join and be a key contributor to our mission of delivering cutting-edge electronic solutions to our clients. Apply now to be a part of a dynamic team dedicated to excellence in PCB assembly and manufacturing.

Openings include:

• Environmental Health & Safety Engineer
• Sales Account Manager, Power Electronics – Automotive (Detroit area)
• Facilities Gas & Chemical Process Engineer
• Industrial Facilities Wastewater Technician
• Are you a Veteran, Military Member, or Military Spouse Interested in a Career at Wolfspeed?
• Don’t See The Job You’re Looking For?
• Facilities Technician
• Manager, Governance, Risk & Compliance
• Industrial Facilities Wastewater Technician
• Solution Architect – Infrastructure
• Logistics Analyst
• Facilities Mechanical Engineer
• Facilities Instrumentation and Controls Technician
• Safety Project Manager
• EHS Engineer
• Facilities Electrical Technician
• High School Students – Class of 2025
• Interested in Working at Wolfspeed’s new Siler City Factory?

The CLAWS Hub (Commercial Leap Ahead for Wide Bandgap Semiconductors), a partnership between NC State University and North Carolina A&T State University within the Microelectronics Commons, is seeking qualified candidates to participate in a Research Experience for Undergraduates (REU) program this Summer. 

Students will work with prestigious faculty on research projects focused on Wide-bandgap (WBG) semiconductors. WBG Semiconductors like Silicon Carbide,and Gallium Nitride enable electronic devices to operate at much higher voltages, frequencies, and temperatures and more efficiently than silicon. These technologies are great for defense and civilian applications where Size, Weight, and Power (SWaP) matter, allowing more electronics on airplanes and satellites, electric vehicles that go further on a battery charge, more powerful and accurate Radars, and faster communication systems. Emerging ultra-wide bandgap semiconductors like Diamond and Gallium Oxide can operate at even higher voltages and may be part of shipboard systems and future electric power grids. Students that participate in this program will work on a variety of materials fabrication and/or characterization techniques with these materials as well receive professional development and networking opportunities. 

• Students will be supported for Summer 2025 (currently scheduled June 1, 2025– August 2, 2025 
• Students will experience hands-on contemporary research topics on wide bandgap materials including synthesis and processing, modeling and characterization, and device fabrication and testing 
• Applicants must be enrolled in an undergraduate degree program and be a US Citizen or permanent resident 
• Selected applicants will receive a $6,000 stipend paid in three increments (beginning, middle, and end) through the duration of their participation. Students will also receive support for on-campus housing 

Interested applicants should send questions or submit their resume, transcript, 1-2 professional references, and a 1-page cover letter demonstrating interest in this topic and program to Phillip Strader (CLAWS Workforce Development Program Manager – phillip_strader@ncsu.edu).

Georgia Institute of Technology (Atlanta, GA), Joint School of Nanoscience and Nanoengineering (Greensboro, NC)

The Institute for Matter and Systems at the Georgia Institute of Tech nology (IMS) and the Joint School of Nanoscience and Nanoengineer ing (JSNN) at the University of North Carolina – Greensboro and  North Carolina Agricultural and Technical State University hosts the  Southeastern Undergraduate Internship in Nanotechnology (SUIN)  REU program. SUIN will provide undergraduates the opportunity to  perform cutting-edge research at the forefront of nanoscale science and  engineering (NSE). This interdisciplinary field will allow students to  see the connections across all science and engineering disciplines and  inspire the next generation of scientists and engineers. IMS and JSNN  make up the Southeastern Nanotechnology Infrastructure Corridor.

APPLICATION DEADLINE

• February 15, 2025 

PROGRAM DATES

MAY 27-AUGUST 6, 2025 10 WEEK PROGRAM 

• $7000 Stipend 
• Travel 
• Housing 

QUALIFICATIONS 

Majors: 

• All Engineering 
• Chemistry 
• Physics 
• Biosciences 
• Must attend a College in the  Southeast 
• Must be a U.S. Citizen or  Permanent Resident 
• Applicants from the Georgia  Institute of Technology, the  University of North Carolina  – Greensboro, or North Carolina A&T are ineligible to participate in this program. 

WIDE RANGE OF RESEARCH 

• Nanotechnology 
• Nanoscience 
• Nanoengineering 
• Engineering 
• Electronics  
• Optical 
• Physics 
• Biological Applications
• Material Science

Get on board and explore exciting interdisciplinary opportunities in Nanotechnology at SENIC’s  facilities.

Job Description

GE Aerospace Research is looking for an intern to join the Semiconductor Device technology organization. As a Semiconductor Device Fellow Intern in Digital & Electrical Systems, you will have the opportunity to engage in the development and evaluation of wide bandgap and ultra-wide bandgap semiconductor device technology which may include device characterization, modeling, and/or process development.  Assignments include working side by side with experts in the field of harsh environment semiconductors, completing challenging technical projects, applying theoretical knowledge to real-life technical problems, and developing skills in a cutting edge global industrial research environment.  

At GE Aerospace Research, scientists, engineers, and technicians are dedicated to pushing the boundaries of aerospace technology and innovation.  Our commitment to Safety, Quality, Delivery, and Cost (SQDC) drives everything we do, ensuring that we deliver the highest standards in the industry.  An internship with us will provide valuable hands-on experience to help you launch your career in industrial research.  Intern assignments are typically for 12-14 weeks; working side by side with experts in the field of systems engineering, completing challenging technical projects and applying theoretical knowledge to real-life technical problems.  This program includes seminars on cross-center technology and soft skills development as well as opportunities for networking and showcasing project accomplishments.

Qualifications/Requirements

• Current enrollment in a full-time PhD program in Electrical Engineering, Material Science & Engineering or related fields at an accredited university
• Legal authorization to work in the U.S.
• Must be willing to work from the GE Aerospace Research office in Niskayuna, NY.
• Minimum GPA 3.0 / 4.0 scale

Desired Characteristics

• Exceptional academic performance·        
• Excellent organizational, analytical, and problem-solving skills, and thorough attention to detail
• Ability to adapt to change and willingness to be flexible in a global team environment
• Effective presentation and technical communication skills; ability to articulate technical problems in clear and simple terms

The pay range for this position is $1,000-$2,000 USD weekly. The specific weekly rate offered to a candidate may be influenced by a variety of factors including the candidate’s experience, their education, and the work location.  GE provides travel reimbursement and housing stipend for qualified interns.

Additional Information

GE Aerospace offers a great work environment, professional development, challenging careers, and competitive compensation. GE Aerospace is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, protected veteran status or other characteristics protected by law.

GE Aerospace will only employ those who are legally authorized to work in the United States for this opening. Any offer of employment is conditioned upon the successful completion of a drug screen (as applicable).

Relocation Assistance Provided: No

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