Employment Opportunities
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Current Openings
CLAWS Openings
III-N Power Integration Engineer
We are seeking a Wide-Bandgap Power Integration Engineer with expertise in GaN power device design, simulation, and modeling. This engineer will lead efforts to establish PDKs for maintained foundry platforms including design libraries with compact models, physical designs, and defined material stacks. The role also involves designing and optimizing high-voltage, high-frequency GaN devices (HEMTs, diodes, FETs), utilizing established EDA tools and developing manufacturable device layouts. The engineer will collaborate cross-functionally with process, circuit, and application teams to translate device innovations into system-level improvements. A Ph.D. or M.S. in a relevant field and at least 3 years of experience in GaN device design and fabrication are required.
III-N RF Integration Engineer
We are seeking a highly skilled RF Integration Engineer to join our team and contribute to the development of next-generation RF semiconductor devices. The ideal candidate will have expertise in GaN RF device and amplifier design, electrical characterization, and device simulation. This role will lead efforts to establish PDKs for maintained CLAWS foundry technologies, supporting foundry customers with a validated GaN MMIC design kit spanning schematic capture through packaged device multi-physics simulations. A Ph.D. or M.S. in a relevant field and at least 3 years of experience in GaN device design and fabrication are required.
Power & RF Electronics Test Engineer
We are seeking a Test Engineer to support the development and characterization of next-generation GaN semiconductor devices, with a focus on RF and power device testing. The role involves executing on-wafer and packaged device tests—including RF measurements up to 40 GHz, high-voltage power device tests, and process control monitor evaluations—using advanced test equipment in a state-of-the-art facility. The engineer will implement new characterization methods, support design-for-test initiatives, and integrate testing workflows with MES and data systems. Responsibilities also include ensuring test equipment availability and accuracy through calibration, maintenance, and documentation of standard operating procedures. Hands-on experience with RF testing and statistical methods such as GR&R is highly desirable.
Semiconductor Packaging Engineer
We are seeking a Semiconductor Packaging Engineer to join our research foundry team, supporting the development of advanced RF, Power, and Photonic devices. This role involves designing, prototyping, and qualifying custom package solutions that meet the unique electrical, thermal, and mechanical requirements of high-frequency, high-voltage, and optoelectronic components. The engineer will work closely with device designers, process engineers, and test teams to define interconnect strategies, perform thermal and mechanical analysis, and ensure compatibility with wafer-level processes and test infrastructure. Responsibilities also include managing vendor interactions, supporting package reliability testing, and contributing to continuous improvements in packaging design and assembly workflows. Experience with advanced packaging techniques, materials selection, and RF/optical signal integrity is preferred.
Manufacturing Systems Engineer
We are seeking a Manufacturing Execution System/Database Engineer to support and enhance the digital infrastructure of our semiconductor research foundry, with a focus on Manufacturing Execution System (MES) development and Oracle database management. The ideal candidate will be responsible for designing, maintaining, and optimizing MES workflows, ensuring seamless integration with fabrication tools, data collection systems, and lab equipment. This role includes managing the Oracle database backend to ensure data integrity, performance, and scalability, while enabling real-time process monitoring, traceability, and reporting. The engineer will collaborate closely with process engineers, IT, and R&D teams to develop custom interfaces, automate data pipelines, and support continuous improvement in manufacturing operations. Experience with MES platforms, Oracle SQL, and semiconductor manufacturing environments is required.
Lithography Engineer
We are seeking a highly skilled lithography engineer to join our team and contribute to the ownership for NNF’s suite of lithography capabilities. This role will provide expert process integration support, deliver repeatable lithographic workflows, and serve as the primary technical lead for lithography toolsets ensuring maximum uptime and process stability through regular baseline monitoring. The ideal candidate will have deep, hands-on experience in all lithographic processes; including contact lithography tools, stepper/projection lithography tools, automated wafer coat/develop stations, and e-beam/laser direct-write systems.
Other Openings
Micross AIT – 2nd Shift Packaging and Assembly Engineer (Research Triangle Park, NC)
Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic systems.
Job Description: 2nd Shift Packaging and Assembly Engineer
Location: Research Triangle Park, NC
Summary:
The Packaging and Assembly Engineer will develop and manage all related assembly processes, such as die attaching, wire bonding, stack die packaging, and flip-chip assembly processing. This engineer will support documentation, implementation, and improving robust mechanical assembly methodology in the areas of IR scene projector arrays, detector modules, RF or Digital semiconductor electrical component and IC chips assembly and packaging in a broad range of configurations.
The Packaging and Assembly Engineer will routinely interact with Program Managers, and Engineering, Quality, as well as External Customers and Suppliers as needed, to provide outstanding assembly and packaging support to ensure revenue and customer satisfaction goals are met!
The applicant should also be willing to work second shift hours (3PM – 12AM).
Essential Duties & Responsibilities:
- Develop and manage assembly processes – such as die attaching, wire bonding, underfill, flip-chip assembly process,
- Assist with development and design of advanced packaging and electromechanical fixturing for customer requirements or internal demands
- Conceive methods and processes to meet customer’s prototype packaging and assembly requirements
- Develop bills of materials and operation routers for assembly projects including time studies and workflow analysis
- Support operation of semiconductor processing equipment
- Drive cost reduction and yield improvement projects
Job Qualifications:
- Semiconductor wafer processing experience in a cleanroom environment is a plus.
- Associate, or BS in physical science/technology/engineering, or 3+ years of cleanroom or semiconductor processing experience
- Due to export control rules, must be a US citizen or permanent resident.
Contact:
- Rex Anderson, Director of Operations: rex.anderson@micross.com
- John Lannon, General Manager: john.lannon@micross.com
Micross AIT – 3D Heterogeneous Integration Development Engineer (Semiconductors) (Research Triangle Park, NC)
Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic systems.
Job Description: 3D Heterogeneous Integration Development Engineer (Semiconductors)
Location: Research Triangle Park, NC
Summary:
This position will support the Micross 3D Heterogeneous Integration program areas, including development of semiconductor advanced packaging processes and technologies such as TSV processing, wafer thinning & handle wafer processes, thermal compression bonding, etc. Wafer-level packaging & interconnects: bumps, Cu pillars, & redistribution
Essential Duties & Responsibilities:
- Support Program Managers and technology development projects in the form of day-to-day project management to ensure customer deliverables and internal development project deliverables are successful and remain on schedule.
- Semiconductor process development, building process flows & lot travelers, lot management & engineering support, as well as providing budgetary input on bids/proposals, and technical support for Program Managers on large proposals.
- Duties may include development of photolithographic processing, wet processing, dry etching, thin film deposition, electroplating, and die assembly processes. The position may also require performing mask design & layout, electrical testing, and other forms of material & process characterization.
Job Qualifications:
- Due to export control rules, must be a US person.
- M.S. or Ph.D. degree in a physical science or engineering, or BS and +5 years’ experience in Advanced Packaging and Interconnects or Semiconductor Processing
- Experience with integrated wafer fabrication process flows strong background in back-end-of-the-line (BEOL) semiconductor processing (e.g. MEMS or other post-CMOS processing). Experience in advanced packaging and/or 3D integration processes is desired.
Contact:
- Rex Anderson, Director of Operations: rex.anderson@micross.com
- John Lannon, General Manager: john.lannon@micross.com
Salary and benefits commensurate with qualifications and experience.
Micross is an equal opportunity employer.
Micross AIT – 2nd Shift Process Engineer (Research Triangle Park, NC)
Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic systems.
Job Description: 2nd Shift Process Engineer
Location: Research Triangle Park, NC
Summary:
The Process Engineer will primarily focus on semiconductor processing required to support wafer level packaging (WLP) and 3D heterogeneous integration (3DHI) processes. This may include sputter deposition, e-beam evaporation, photoresist coats, photoresist develops, dry etches, resist strips, immersion wet etches, microscope inspections, and thin film metrology. The successful candidate will need to develop an understanding of relevant process integration dependencies. Understanding the importance of processing results and the need for supporting lot/project schedules is critical.
The Packaging and Assembly Engineer will routinely interact with Program Managers, Engineering, Quality, as well as external customers and suppliers as needed, to provide outstanding semiconductor fabrication support to ensure revenue and customer satisfaction goals are met!
The applicant should also be willing to work second shift hours (3PM – 12AM).
Essential Duties & Responsibilities:
- Hands-on engineering resource for wafer processing of both test and device wafers. • Communicating results and concerns in a collaborative, data-driven environment.
- Participate and conduct process improvement experiments, as needed; accurately recording and reporting data
- Employ standard troubleshooting protocols
- Support operation of semiconductor processing equipment
- Drive cost reduction and yield improvement projects
Job Qualifications:
- Semiconductor wafer processing experience in a cleanroom environment is a plus.
- Associate, or BS in physical science/technology/engineering, or 3+ years of cleanroom or semiconductor processing experience
- Due to export control rules, must be a US citizen or permanent resident.
Contact:
- Rex Anderson, Director of Operations: rex.anderson@micross.com
- John Lannon, General Manager: john.lannon@micross.com
Micross AIT – 2025 Spring and Summer Internships (Research Triangle Park, NC)
Micross Advanced Interconnect Technology (AIT) is looking for engineers interested in a wafer processing internship at our Research Triangle Park, NC facility. As part of the internship, the interns will assist our operations team in standard wafer processes such as sputter deposition, dry etch (RIE), photolithography, wet etch, resist coats, polymer coats, resist strips, microscope inspections, and thin film metrology. The internships run during the Spring semester with an option to extend through the summer. Micross AIT pays interns an hourly rate with compensation dependent upon the years of school completed toward your degree.
Micross AIT is a semiconductor microfabrication facility offering advanced packaging and 3D heterogeneous integration (3DHI) solutions that enable higher-performance, next generation electronic systems.
If you are interested in an internship at Micross AIT, please contact:
- Rex Anderson, Director of Operations: rex.anderson@micross.com
- John Lannon, General Manager: john.lannon@micross.com
Protronics – IPC Instructor in North Carolina and Virginia
Company Overview:
Protronics is a leading player in the field of Printed Circuit Board (PCB) assembly and manufacturing, specializing in delivering high-quality electronic solutions to diverse industries. Our commitment to innovation, precision, and efficiency sets us apart, we are seeking a skilled IPC instructor to join our dynamic team and contribute to the production of high-quality electronic products.
Key Responsibilities:
Electronics Manufacturing Training:
- Delivering effective electronics manufacturing training including IPC Certification to adult students from the electronics manufacturing industry.
- Train and certify operators, inspectors, engineers and other trainers to one of six IPC Certification Programs: IPC-A-600, IPC-A-610, IPC/WHMA-A-620, IPC J-STD-001, IPC 7711/7721 and IPC-6012.
- Conduct training at one of our public training centers or will travel directly to the customer’s facility.
Collaboration:
- Work closely with engineers and other team members to identify training and workforce development opportunities.
- Provide input on process improvements to enhance efficiency and product quality.
Documentation:
- Maintain accurate records of IPC training activities, including certifications and work performed.
- Report any deviations from processes or quality issues to supervisors.
Safety Compliance:
- Adhere to safety protocols and guidelines to ensure a secure working environment.
- Participate in safety training programs and promote a culture of safety within the team.
Qualifications:
Experience:
- Candidates must have a minimum of 5 years of electronics manufacturing experience. This experience can include printed circuit board fabrication, circuit board assembly, and/or wire and cable harness assembly. Soldering experience of through-hole and/or surface mount components is highly preferred.
- Technical certification in electronics, PCB assembly, or a related field is a plus.
- Familiarity with IPC standards and industry best practices.
Skills:
- Candidate must have IPC training experience, either currently or in the past. A current and valid Certified IPC Trainer certificate holder is highly preferred.
- Applicants must have the ability to work with little to no supervision and make appropriate and professional decisions.
- Proficient in surface mount and through-hole soldering.
- Strong attention to detail and precision in assembly work.
- Ability to read and interpret assembly drawings and specifications.
Team Player:
- Effective communication and collaboration skills within a team environment.
- The candidate’s home location is not critical, however, proximity to the North Carolina or Virginia area is a plus. Relocation is not required. Several IPC Certification courses can be taught remotely and require no travel.
Benefits:
- Competitive salary commensurate with experience.
- Comprehensive health and retirement benefits.
- Opportunities for professional development and growth.
- A collaborative and innovative work environment.
How to Apply:
Interested candidates are invited to submit their resumes and cover letter to quadri@protroincs-inc.com
Protronics is an equal-opportunity employer. We encourage candidates from all backgrounds to apply.
Join and be a key contributor to our mission of delivering cutting-edge electronic solutions to our clients. Apply now to be a part of a dynamic team dedicated to excellence in PCB assembly and manufacturing.
Wolfspeed – Multiple Positions Available
Openings include:
- Environmental Health & Safety Engineer
- Sales Account Manager, Power Electronics – Automotive (Detroit area)
- Facilities Gas & Chemical Process Engineer
- Industrial Facilities Wastewater Technician
- Are you a Veteran, Military Member, or Military Spouse Interested in a Career at Wolfspeed?
- Don’t See The Job You’re Looking For?
- Facilities Technician
- Manager, Governance, Risk & Compliance
- Industrial Facilities Wastewater Technician
- Solution Architect – Infrastructure
- Logistics Analyst
- Facilities Mechanical Engineer
- Facilities Instrumentation and Controls Technician
- Safety Project Manager
- EHS Engineer
- Facilities Electrical Technician
- High School Students – Class of 2025
- Interested in Working at Wolfspeed’s new Siler City Factory?
Coherent – Multiple Positions Available
- Data/Software Engineering – Pine Brook
- CMP Engineering – Easton
- Program Mgmt. – Easton
- R&D – San Jose
- Maintenance – San Jose
- Product Management – Pine Brook